Package for receiving electronic parts, and electronic device and mounting structure thereof

An electronic device comprising:

• an electronic part;
• a package that receives the electronic part;
• and
• a sealing member that seals the electronic part;
• wherein the package comprises:
• a heat radiating plate having a surface including a mounting area where the electronic part is mounted;
• a frame body adhered to the surface surrounding the mounting area and defining an interior area of the package and an exterior area of the package;
• and
• a wiring conductor derived from the interior area to the exterior area;
• wherein the heat radiating plate comprises:
• a metallic base body defining a hole located under the electronic part and mounting area;
• a metallic body filling inside of hole;
• and
• a metal layer on the metallic base body and the metallic body;
• wherein the mounting area is located on the metal layer above the metallic body;
• wherein both the metallic body and the metal layer have higher thermal conductivity than the metallic base body;
• wherein both the frame body and the metallic base body have a smaller coefficient of thermal expansion than the metal layer;
• wherein the electronic part is electrically connected with the wiring conductor;
• and
• wherein an outer circumference of the metallic body is located outside of an outer circumference of the electronic part when the heat radiating plate is viewed in a plane perspective.