Stress absorption layer and cylinder solder joint method and apparatus
AssigneeIntel Corporation
InventorJiun Hann Sir
Life of this patent
Estimating the term…
Abstract
An apparatus, method, and system for providing a stress absorption layer for integrated circuits includes a stiffening layer adapted to limit flexing. A compliance layer is physically associated with the stiffening layer, with the compliance layer adapted to absorb stress caused by mismatched thermal properties between two materials. A thru hole passes through both the stiffening layer and the compliance layer, with the thru hole being adapted to receive a solder joint. The stress absorption layer contacts both a semiconductor package and a substrate. The solder joint disposed in the thru hole connects the semiconductor package to the substrate.
Claims18
An apparatus comprising:
- a semiconductor package including a die mounted on a package substrate;
- a printed circuit board;
- a non-conductive stiffening layer configured to limit flexing, the stiffening layer having a first surface and a second surface;
- a non-conductive first compliance layer physically associated with the first surface of the stiffening layer and in direct physical contact with a major surface of the package substrate;
- a non-conductive second compliance layer physically associated with the second surface of the stiffening layer opposite the first surface, and in direct physical contact with a major surface of the printed circuit board, at least one of the first compliance layer and the second compliance layer being configured to absorb stress between the stiffening layer and at least one of the semiconductor package and the printed circuit board;
- and
- a thru hole passing through the stiffening layer, the first compliance layer, and the second compliance layer.
A system comprising:
- a semiconductor package including a die mounted on a package substrate;
- a printed circuit board;
- a mechanical insert including:
- a non-conductive stiffening layer configured to limit flexing;
- a non-conductive first compliance layer physically associated with a first surface of the stiffening layer and in direct physical contact with a major surface of the package substrate;
- a non-conductive second compliance layer physically associated with a second surface opposite the first surface of the stiffening layer, and in direct physical contact with a major surface of the printed circuit board, at least one of the first compliance layer and the second compliance layer configured to absorb stress between the mechanical insert and at least one of the semiconductor package and the printed circuit board;
- and
- a thru hole passing through the stiffening layer, the first compliance layer, and the second compliance layer;
- a solder joint disposed in the thru hole and connecting the semiconductor package to the printed circuit board;
- a bus coupled to the semiconductor package;
- and
- a mass storage coupled to the bus.
Dependencies are inferred from the claim text.