Semiconductor device having RF shielding and method therefor
AssigneeAmkor Technology, Inc.
InventorsTimothy L. Olson, Christopher M. Scanlan, Christopher J. Berry
Life of this patent
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Abstract
A semiconductor device has a substrate comprising at least one dielectric layer and at least one metal layer on a first surface of the substrate. A die is attached to the first surface of the substrate. A mold compound is used to encapsulate the die and partially encapsulate the first surface of the substrate. The mold compound has a protrusion proximate to the at least one metal layer. A conductive material covers the mold compound, including the protrusion, and contacts the at least one metal layer.
Claims20
A semiconductor device comprising:
- a substrate comprising at least one dielectric layer and at least one metal layer on a first surface of the substrate;
- a die attached to the first surface of the substrate;
- a mold compound encapsulating the die and partially encapsulating the first surface of the substrate, the mold compound having a protrusion formed below a top surface of the mold compound, an angled surface of the mold compound extending from the protrusion, the at least one metal layer exposed along a distal end of the angled surface;
- and
- a conductive material that covers the mold compound, including the protrusion, and contacts the at least one metal layer exposed.
A semiconductor device comprising:
- a substrate having at least one metal layer on a first surface of the substrate;
- a die attached to the first surface of the substrate;
- a mold compound encapsulating the die and partially encapsulating the first surface of the substrate, the mold compound having a ridge formed below a top surface of the substrate, a surface of the mold compound extending from the ridge and exposing the at least one metal layer on the first surface of the substrate;
- and
- a conductive material that covers the mold compound, including the ridge, and contacts the at least one metal layer.
A semiconductor device comprising:
- a substrate having at least one metal layer on a first surface of the substrate;
- a die attached to the first surface of the substrate;
- a mold compound encapsulating the die and partially encapsulating the first surface of the substrate, the mold compound having a ridge, wherein the ridge comprises:
- an L-shaped ledge formed on at least one side surface of the mold compound;
- and
- an angled surface running away from a horizontal member of the L-shaped ledge, the at least one metal layer exposed at a bottom of the angled surface;
- and
- a conductive material that covers the mold compound, including the ridge, and contacts the at least one metal layer.
Dependencies are inferred from the claim text.