Semiconductor device with contact stabilization between contact plugs and bit lines and method for manufacturing the same

A method for manufacturing a semiconductor device, comprising the steps of:

• forming bit lines in a cell array region, a core region, and a peripheral region of a semiconductor substrate;
• forming an interlayer dielectric covering the bit lines in the respective regions, and forming grooves in the interlayer dielectric around the bit lines in the core region and the peripheral region;
• forming storage node contact plugs in the cell array region, and forming blocking patterns around the bit lines of the core region and the peripheral regions, wherein the forming the blocking patterns comprises filling the grooves with a layer so as to form the blocking patterns for blocking formation of metal contact plugs below the blocking patterns;
• forming capacitors in the cell array region to come into contact with the storage node contact plugs;
• and
• forming the metal contact plugs to come into contact with the capacitors of the cell array region and the bit lines of the core region and the peripheral region.