Nitride-based semiconductor device with reduced leakage current
AssigneeSanken Electric Co., Ltd.
InventorsKoji Otsuka, Emiko Chino, Masataka Yanagihara
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AssigneeSanken Electric Co., Ltd.
InventorsKoji Otsuka, Emiko Chino, Masataka Yanagihara
Estimating the term…
A high electron mobility transistor is disclosed which has a triple-layered main semiconductor region formed on a silicon substrate via a multilayered buffer region. The multilayered buffer region is in the form of alternations of an aluminum nitride layer and a gallium nitride layer. Whilst the aluminum nitride layers are of n-like conductivity, the gallium nitride layers are doped into p-type conductivity, with the consequent creation of pn junctions between the two kinds of buffer layers. Another pn junction is formed between one p-type gallium nitride layer and the adjoining n-like electron transit layer included in the main semiconductor region. The pn junctions serve for reduction of current leakage.
A nitride-based semiconductor device of reduced current leakage, the semiconductor device comprising:
A nitride-based semiconductor device of reduced current leakage, the semiconductor device comprising:
Dependencies are inferred from the claim text.