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US 7,745,844 B2Granted
Light-emitting diode package and manufacturing method thereof
AssigneeLG Innotek Co., Ltd.
InventorKyung Ho Shin
Life of this patent
Estimating the term…
Abstract
An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
Claims19
A light-emitting diode package, comprising:
- a metal plate including a first portion of an upper surface and a second portion of the upper surface beside the first portion of the upper surface of the metal plate;
- an insulating layer on the metal plate;
- circuit patterns on the insulating layer;
- and
- a light-emitting diode disposed on the first portion of the upper surface of the metal plate and electrically connected with the circuit patterns,
- wherein at least a portion of the second portion of the upper surface of the metal plate comprises grooves, and
- wherein the grooves of the second portion of the upper surface of the metal plate do not include light-emitting diodes therein.
4 more elements
An apparatus, comprising:
- a metal plate having grooves on an upper surface thereof, wherein the upper surface of the metal plate includes a first portion and a second portion beside the first portion, and wherein the grooves are formed on at least a portion of the second portion of the upper surface of the metal plate;
- an insulating layer on the metal plate, the insulating layer comprising an opening portion corresponding to the grooves of the metal plate;
- a circuit pattern on the insulating layer;
- and
- an electronic device disposed on a portion of the upper surface of the metal plate and electrically connected with the circuit pattern on the insulating layer,
- wherein the bottoms of the grooves do not include circuit patterns.
3 more elements
A method for manufacturing a light-emitting diode package, the method comprising:
- preparing a metal core printed circuit board comprising a metal plate, an insulating layer on the metal plate, and circuit patterns on the insulating layer, wherein the metal core printed circuit board includes a first portion and a second portion beside the first portion at an upper surface thereof;
- selectively removing at least a portion of the metal plate and the insulating layer to form grooves at the second portion of the metal core printed circuit board;
- mounting a light-emitting diode on the first portion of the metal core printed circuit hoard;
- and
- electrically connecting the light-emitting diode with the circuit patterns,
- wherein the grooves at the second portion of the metal core circuit board do not include light-emitting diodes therein.
3 more elements
Dependencies are inferred from the claim text.