Semiconductor light-emitting element assembly with a composite substrate

A semiconductor light-emitting element assembly comprising:

• a composite substrate with a thermal expansion coefficient substantially smaller than or equal to 12×10−6/° C., and a thermal conductivity coefficient substantially greater than or equal to 150 W/mK;
• a circuit layout carrier;
• a connecting structure for bonding the composite substrate with the circuit layout carrier;
• a semiconductor light-emitting element disposed on one side of the composite substrate and electrically connected to the circuit layout carrier;
• and
• a recess formed on the circuit layout carrier and extending toward the composite substrate, wherein the semiconductor light-emitting element is deposited in the recess.