Interconnecting substrate and semiconductor device

An interconnecting substrate comprising:

• a base insulating film having a sunken section in a bottom surface thereof,
• a first interconnection provided in the sunken section,
• a via hole formed in the base insulating film, and
• a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film,
• wherein the interconnecting substrate comprises
• a first interconnection pattern formed of the first interconnection which comprises at least a linear pattern which extends along a second direction orthogonal to a first direction and has a component ratio of a Y-component extending along the second direction to an X-component extending along the first direction (Y/X) which is larger than 1, and
• a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and has a component ratio of the Y-component to the X-component (Y/X) which is smaller than 1.

An interconnecting substrate, comprising:

• a base insulating film having a sunken section in a bottom surface thereof,
• a first interconnection provided in the sunken section,
• a via hole formed in the base insulating film, and
• a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film,
• wherein the interconnecting substrate comprises:
• a first interconnection pattern formed of the first interconnection which comprises at least a linear pattern which extends along a second direction orthogonal to a first direction, and
• a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction;
• the warpage-controlling pattern is a line and space pattern orthogonal to the second direction;
• and
• a total pattern component ratio of a Y-component extending along the second direction to an X-component extending along the first direction (Y/X) of the whole pattern comprising the warpage-controlling pattern and the first interconnection pattern is within the range of 70/30 to 30/70.