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US 7,745,730 B2Granted
Wiring component
AssigneeBeru F1 Systems Limited
InventorJohn Michael Bailey
Life of this patent
Estimating the term…
Abstract
A wiring component includes an array of multiple wires, at least one connector which engages the wires, and at least two layers of a hardened fiber and a filler compound that sandwiches the wires. The areas adjacent to the wires include a filler which immobilizes the wires relative to the layers. In one embodiment at least a portion of the connector is embedded in the filler.
Claims29
A wiring component comprising:
- an array of multiple wires;
- at least one connector which engages said wires;
- at least two layers of a hardened compound of fiber and a filler sandwiching said wires;
- the areas adjacent to the wires also comprising one of said filler and an additional filler which immobilizes the wires relative to said layers;
- wherein at least a portion of said connector is embedded in one of said filler and said additional filler;
- whereby said connector is immobilized relative to said layers.
3 more elements
A wiring component comprising:
- an array of multiple wires;
- at least two layers of a hardened compound incorporating a fiber and a resin, said hardened compound sandwiching said array;
- and a filler filling the areas adjacent to the wires;
- whereby at least one of said filler and said hardened compound immobilizes the wires relative to said layers;
- wherein the fibers are woven;
- and the wiring component is a rigid structure;
- wherein the component incorporates a substantially planar portion and a lip extending from said planar portion, the lip running substantially along at least one edge of the length of the planar portion at an angle.
4 more elements
A wiring component comprising:
- an array of multiple wires;
- at least two layers of a hardened compound incorporating a fiber and a resin, said hardened compound sandwiching said array;
- and a filler filling the areas adjacent to the wires;
- whereby at least one of said filler and said hardened compound immobilizes the wires relative to said layers;
- wherein the wires comprise copper and at least one sheath creating a bond between the wires and layers;
- wherein the wiring component is a rigid structure;
- wherein the component incorporates a substantially planar portion and a lip extending from said planar portion, the lip running substantially along at least one edge of the length of the planar portion at an angle.
4 more elements
A wiring component comprising:
- an array of multiple wires;
- at least two layers of a hardened compound incorporating a fiber and a resin;
- said hardened compound sandwiching said array;
- and a filler filling the areas adjacent to the wires;
- whereby at least one of said filler and said hardened compound immobilizes the wires relative to said layers;
- wherein the wires comprise copper and at least one sheath creating a bond between the wires and layers;
- wherein the wiring component is a rigid structure;
- wherein said at least one sheath is resistant to 100 degrees Celsius in a vacuum oven.
5 more elements
A method of producing a wiring component, the method comprising the steps of:
- placing a plurality of wires between layers of a hardenable fiber and resin compound;
- vacuuming air from the array;
- placing the layers and wires on a mold;
- heat treating the array in a vacuum oven;
- and
- allowing the wiring component to cool into a rigid component.
3 more elements
A wiring component comprising:
- an array of multiple wires;
- at least one connector which engages said wires;
- at least two layers of a hardened fiber and a filler compound sandwiching said wires;
- the areas adjacent to the wires also comprising said filler compound which immobilizes the wires relative to said layers;
- wherein at least a portion of said connector is embedded in said filler compound and wherein the connector incorporates a cap protecting its connectable portion;
- wherein said cap incorporates a seal on the inside of said cap.
3 more elements
Dependencies are inferred from the claim text.