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US 7,745,322 B2Granted
Wire bond interconnection
AssigneeChipPAC, Inc.
InventorsHun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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AssigneeChipPAC, Inc.
InventorsHun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
Estimating the term…
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.
A method for forming a wire bond interconnection between a semiconductor die and a substrate, comprising providing a die affixed on a die mount portion of a first side of a substrate and oriented with the active side away from the substrate, the substrate having patterned traces including lead fingers in the first side of the substrate;
Dependencies are inferred from the claim text.