Methods and apparatus for high-density chip connectivity

A method for aligning a first and a second chip, said method comprising:

• contacting at least one first self-alignment feature of a first chip with at least one second self-alignment feature of a second chip, the first chip and second chip having a plurality of conductive pads having top surfaces of approximately the same dimensions;
• and
• moving the first and second chips relative to each other to enable the at least one first and second self alignment features to self align in a manner causing at least a subset of the top surfaces of the first and second conductive pads to contact one another.

A method of communicating signals between chips, comprising:

• communicating electrical signals between a first chip and a second chip, the electrical signals passing from a first conductive pad disposed on the first chip to a second conductive pad disposed on the second chip, at least a subset of the first and second conductive pads being in contact with one another and bonded together, and providing for the electrical signals to be communicated between the first and second chips at a clock rate substantially the same as on one of the chips.