Semiconductor device and a method of manufacturing the same

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) forming an isolation region in a main surface of a semiconductor substrate such that an active region is defined by the isolation region;
• (b) forming over the main surface of the semiconductor substrate an insulating film for charge storage of a non-volatile memory cell;
• (c) forming over the insulating film for charge storage a first gate electrode having a first side face and a second side face, the first and second side faces being positioned at opposite sides of the first gate electrode in a direction along the main surface of the semiconductor substrate;
• (d) forming in the main surface of the semiconductor substrate a first semiconductor region in a self-alignment manner with respect to the first side face of the first gate electrode;
• (e) after the step (d), depositing a first insulating film over the main surface of the semiconductor substrate;
• (f) after the step (e), etching the first insulating film and a surface of the first semiconductor region so as to form a first insulating film side wall over the first side face of the first gate electrode and a first depression in a region of the first semiconductor adjacent to the first insulating film side wall;
• (g) after the step (f), forming in the main surface of the semiconductor substrate a second semiconductor region in a self-alignment manner with respect to a side face of the first insulating film side wall, the second semiconductor region being electrically coupled to the first semiconductor region;
• (h) after the step (g), depositing a second insulating film over the main surface of the semiconductor surface;
• (i) after the step (h), etching the second insulating film so as to form a second insulating film side wall over the side face of the first insulating film side wall and to cover a side surface of the semiconductor substrate exposed by the first depression;
• and
• (j) after the step (i), forming a first silicide layer over the second semiconductor region, the first silicide layer being formed in a self-alignment manner with respect to a side face of the second insulating film side wall.