System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

A method of routing signals from bond fingers of a lead frame to a first die and a second die, the second die being positioned adjacent to the first die on the lead frame, the method comprising:

• routing a first signal from a first bond finger to a first receiving segment of a first signal bus, the first receiving segment being positioned along a first outer edge of the first die in a direction parallel to the first outer edge of the first die, the first receiving segment having a length equal to at least a distance between the first bond finger and a second bond finger of the lead frame;
• routing the first signal from the first receiving segment to a distribution segment of the first signal bus, the distribution segment being positioned along an inner edge of the first die in a direction parallel to the inner edge of the first die, the distribution segment having a length equal to at least a distance between a first bond pad and a third bond pad positioned along the inner edge of the first die;
• routing the first signal from the distribution segment to the first bond pad to thereby provide the first signal to the first die;
• and
• routing the first signal to the second die by routing the first signal from the distribution segment to a second bond pad positioned adjacent to an inner edge of the second die, the inner edge of the second die being adjacent to the inner edge of the first die.