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US 7,745,255 B2Granted
Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Hyun Lee, Hyung-Moo Park
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Abstract
An electronic device having a bonding pad structure and a method of fabricating the same is provided. The electronic device may include a first bonding pads formed on the substrate. A second bonding pad may be formed on the lower insulating layer. The second bonding pads may be spaced apart from the first bonding pads. The second bonding pads may have a top surface formed at a higher level than the first bonding pads.
Claims10
A method of fabricating an electronic device having a bonding pad structure, comprising:
- forming a first bonding pad on a substrate;
- forming a second bonding pad spaced apart from the first bonding pad, wherein a top surface of the second bonding pad is formed at a higher level than the first bonding pad,
- wherein the bonding pad structure includes at least two first bonding pads and at least two second bonding pads;
- forming a lower insulating layer on the substrate, wherein the first bonding pads pass through the lower insulating layer;
- forming an upper insulating layer on a portion of the substrate having the first bonding pads, wherein the second bonding pads sequentially pass through the upper insulating layer and the lower insulating layer;
- and
- exposing top surfaces of the first bonding pads by etching the upper insulating layer using the second bonding pads as etching masks.
4 more elements
Dependencies are inferred from the claim text.