Back to results
US 7,745,244 B2Granted
Pin substrate and package
AssigneeFairchild Semiconductor Corporation
InventorsZhongfa Yuan, Yong Liu, Yumin Liu, Qiuxiao Qian
Life of this patent
Estimating the term…
Abstract
A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.
Claims15
A method of forming a substrate for use in a semiconductor package, the method comprising:
- inserting a plurality of conductive wires into an alignment fixture;
- placing at least a portion of the plurality of conductive wires and at least a portion of the alignment fixture in a mold, wherein the mold is separate from the alignment fixture;
- filling the mold with a molding compound;
- curing the molding compound to create a pre-substrate block;
- and
- cutting the pre-substrate block, wherein cutting the pre-substrate block comprises cutting the plurality of conductive wires.
3 more elements
A method of forming a substrate for use in a semiconductor package, the method comprising:
- placing a plurality of conductive wires in a mold, wherein the placing a plurality of conductive wires in a mold includes placing the plurality of conductive wires within an alignment fixture, wherein the alignment fixture includes a top plate having holes and a bottom plate having holes, wherein the mold includes a slot, the method further comprising putting the top plate within the slot;
- filling the mold with a molding compound;
- curing the molding compound to create a pre-substrate block;
- and
- cutting the pre-substrate block.
2 more elements
Dependencies are inferred from the claim text.