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US 7,745,240 B2Granted
Manufacturing method of light-emitting element with surface layer removal
AssigneeEudyna Devices Inc.
InventorAkira Furuya
Life of this patent
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Abstract
A manufacturing method of a light-emitting element includes emitting a laser light to a division region for separating a light-emitting element formed on a substrate, physically dividing the substrate along the division region, and removing a surface layer on at least one of the side faces of the substrate that is exposed by the dividing of the substrate.
Claims5
A manufacturing method of a light-emitting element comprising:
- irradiating a laser light to a division region for separating light-emitting elements formed on a substrate;
- physically dividing the substrate along the division region after the step of irradiating a laser light;
- expanding an extensible sheet on which the light-emitting elements are adhered so that an interval between each of the light-emitting elements is more than half of a width of the light-emitting elements, after a step of physically dividing the substrate;
- and
- removing an altered layer, that is formed during irradiating the laser light, on at least one of the side faces of the substrate that is exposed by the dividing of the substrate with a blast method, after a step of expanding the extensible sheet.
2 more elements
Dependencies are inferred from the claim text.