Back to results
US 7,745,235 B2Granted
Method for manufacturing semiconductor sensor
AssigneeRicoh Company, Ltd.
InventorKazunari Kimino
Life of this patent
Estimating the term…
Abstract
A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.
Claims13
A method of manufacturing a semiconductor sensor, comprising the steps of:
- removing a predetermined portion of a semiconductor substrate selectively except for at least a region where a supporting part is to be formed so as to form a weight arranging part and a flexible part;
- and
- forming a weight on a surface of the semiconductor substrate at the weight arranging part, and said weight comprises a resin part provided on the weight arranging part, said resin part being made of resin, and a central part provided on the resin part, said metal part including at least a metal.
Dependencies are inferred from the claim text.