Photosensitive polyimide composition, polyimide film and semiconductor device using the same

A method of chip scale packaging, the method comprising:

• providing a wafer;
• and
• forming a redistribution layer on the wafer using photolithographic process with a photosensitive polyimide composition, the photosensitive polyimide composition comprising polyhydroximide, a cross-linking agent comprising two or more vinylether groups, and a photoacid generator;
• arranging a solder ball on the redistribution layer;
• and
• soldering the solder ball.

A photolithographic method comprising:

• mixing a polyhydroxyimide, a cross-linking agent comprising two or more vinylether groups, and solvent;
• adding a photoacid generator to provide a photosensitive polyimide composition;
• coating a wafer with the photosensitive polyimide composition;
• baking the coated wafer at a temperature of less than about 150° C.;
• exposing the coated wafer to light;
• treating the coated wafer at a temperature of less than about 150° C.;
• and
• developing the coated wafer in an aqueous solution to provide a wafer with a patterned film.

A photolithographic method comprising:

• mixing a polyhydroxyimide, a cross-linking agent comprising two or more vinylether groups, and solvent;
• adding a photoacid generator to provide a photosensitive polyimide composition;
• coating a wafer with the photosensitive polyimide composition;
• pre-baking the coated wafer at a temperature of less than 100° C.;
• baking the coated wafer at a temperature of less than about 150° C.;
• exposing the coated wafer to light;
• treating the coated wafer at a temperature of less than about 150° C.;
• and
• developing the coated wafer in an alkaline aqueous solution to provide a wafer with a patterned film.