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US 7,745,013 B2Granted
Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
AssigneeIntel Corporation
InventorsHeeman Choe, Daewoong Suh
Life of this patent
Estimating the term…
Abstract
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.
Claims16
An article comprising:
- a foamed solder core of a first material;
- a substrate upon which the foamed solder core is disposed,
- an intermediate solder layer disposed upon the substrate and in contact with the foamed solder core, wherein the intermediate solder layer includes an average grain-size diameter of about 20 micrometers;
- and
- a bond pad as part of the substrate, wherein the bond pad is in contact with the intermediate solder layer, and wherein the bond pad includes a grain morphology characteristic of elongated columnar.
2 more elements
An article comprising:
- a foamed solder core of a first material;
- a substrate upon which the foamed solder core is disposed, wherein the foamed solder core of a first material includes copper;
- an intermediate solder layer disposed upon the substrate and in contact with the foamed solder core, wherein the intermediate solder layer includes copper;
- and
- a bond pad as part of the substrate, wherein the bond pad is in contact with the intermediate solder layer, wherein the bond pad includes a grain morphology characteristic of elongated columnar, and wherein the bond pad includes copper.
2 more elements
Dependencies are inferred from the claim text.