Method of forming carbon nanotube on semiconductor substrate, method of forming semiconductor metal wire using the same, and method of fabricating inductor using the same
AssigneeKorea Advanced Institute of Science and Technology
InventorsByung Chul Lee, Jeong Oen Lee, Yang Kyu Choi, Jun-Bo Yoon
Life of this patent
Estimating the term…
Abstract
A method of fabricating a semiconductor device by filling carbon nanotubes in a recess is disclosed. The method of fabricating the semiconductor device comprises patterning a mold on a substrate, coating carbon nanotubes on an entire surface of the recess and the mold formed by the patterning, filling the carbon nanotubes coated on the an entire surface of the mold in the recess, and removing the mold.
Claims21
A method of forming carbon nanotubes on a substrate, comprising:
- (a) patterning a mold on an upper surface of the substrate to form a recess;
- (b) coating carbon nanotubes on an upper surface of the recess and an upper surface of the mold;
- (c) filling the carbon nanotubes that are coated on the upper surface of the mold in the recess by using a flattening tool;
- and
- (d) removing the mold.
A method of forming semiconductor metal wire using carbon nanotubes, comprising:
- (a) patterning a first mold to form a recess on an upper surface of a substrate and forming a first metal on the substrate in which the first mold is patterned;
- (b) coating carbon nanotubes on an upper surface of the first metal;
- (c) filling the carbon nanotubes that are coated on the upper surface of the first metal in the recess, and forming a second mold on the upper surface of the first metal;
- (d) plating a second metal on an upper surface of a carbon nanotube structure filled in the recess;
- and
- (e) removing the first mold, the second mold, and the first metal.
A method of fabricating an inductor using carbon nanotubes, comprising:
- (a) forming a first metal on an upper surface of a substrate, and then patterning a first mold on an upper surface of the first metal to form a recess and a via hole;
- (b) plating the inside of the via hole with a second metal;
- (c) forming a third metal on the substrate that is formed by the step (b);
- (d) coating carbon nanotubes on the substrate that is formed by the step (c), then filling the coated carbon nanotubes in the recess to form a carbon nanotube structure, and injecting a liquid in the recess;
- (e) patterning a second mold on the substrate that is formed by the step (d);
- (f) plating a fourth metal on an upper surface of the carbon nanotube structure;
- and
- (g) removing the first mold, the second mold, and the first to third metals,
- wherein the carbon nanotubes are dispersed in a predetermined solvent.
A method of fabricating an inductor using carbon nanotubes, comprising:
- (a) patterning a first mold on an upper surface of a substrate to form a recess and a via hole;
- (b) forming a first metal on the substrate that is formed by the step (a);
- (c) coating carbon nanotubes on the substrate that is formed by the step (b), then filling the carbon nanotubes in the recess to form a carbon nanotube structure, and injecting a fluid into the recess;
- (d) forming a second mold on an upper surface of the first metal;
- (e) plating a second metal on an upper surface of the carbon nanotube structure;
- and
- (f) removing the first mold, the second mold, the first metal, and the second metal.
A method of forming carbon nanotubes on a substrate comprising:
- (a) patterning a mold on a surface of a substrate to form a recess, the recess exposing a portion of the surface of the substrate;
- (b) providing carbon nanotubes on the exposed portion of the surface of the substrate and an upper surface of the mold;
- (c) filling the recess with the carbon nanotubes that are provided on the upper surface of the mold;
- and
- (d) removing the mold.
Dependencies are inferred from the claim text.