Paste patterns formation method and transfer film used therein
AssigneeE.I. du Pont de Nemours and Company
InventorHideki Akimoto
Life of this patent
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Abstract
Disclosed is a paste pattern formation method comprising the steps of: forming a transfer pattern material on a film base material to prepare a transfer film; sticking the transfer film on a substrate on which a transfer pattern is formed so that the transfer pattern material contacts the substrate; separating the film base material from the transfer pattern material; filling a paste into the transfer pattern depression; solidifying the paste; and removing the transfer pattern material.
Claims17
A paste pattern formation method comprising the steps of:
- applying a transfer pattern on a film base material, wherein said transfer pattern comprises a transfer pattern material and transfer pattern depressions, thus forming a transfer film;
- transferring the transfer film, onto a substrate so that the transfer pattern material contacts the substrate and so that the film base material is on the back of the transfer pattern material;
- separating the film base material from the transfer pattern material;
- applying a paste into the transfer pattern depressions, resulting in a paste pattern adhering to the substrate;
- solidifying the paste;
- and then
- removing the transfer pattern material, that is located around the solidified paste on the substrate, leaving only the solidified paste on the substrate.
A paste pattern formation method comprising the steps of:
- applying a transfer pattern material on a film base material;
- forming transfer pattern depression(s) in the transfer pattern material, thus forming a transfer film;
- transferring the transfer film onto a substrate so that the transfer pattern material contacts the substrate and the film base material is on the back of the transfer pattern material;
- separating the film base material from the transfer pattern material;
- applying a paste into the transfer pattern depression(s), resulting in a paste pattern adhering on the substrate;
- solidifying the paste;
- and then
- removing the transfer pattern material, that is located around the solidified paste on the substrate, leaving the solidified paste on the substrate.
Dependencies are inferred from the claim text.