Solder alloy for bonding oxide material, and solder joint using the same
AssigneeHitachi Metals, Ltd.
InventorsMinoru Yamada, Nobuhiko Chiwata, Takayuki Moriwaki
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Abstract
The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.
Claims6
A solder alloy for bonding an oxide material, consisting of, by mass, more than 0.17% but not more than 1.0% of Mg, 44.25-60% of Bi and the balance being Sn and unavoidable impurities.
Dependencies are inferred from the claim text.