Composite electroless plating
AssigneeSurface Technology, Inc.
InventorsThomas Steven Lancsek, Michael David Feldstein
Life of this patent
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Abstract
This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.
Claims22
An electroless metallizing bath comprising an aqueous solution of a metal salt, a reducing agent, and particulate matter wherein said electroless metallizing bath is essentially free of heavy metal stabilizers.
An electroless metallizing bath comprising an aqueous solution of a metal salt, a reducing agent, and particulate matter wherein said electroless metallizing bath is essentially free of toxic metal stabilizers.
An electroless metallizing bath comprising an aqueous solution of a metal salt, a reducing agent, and particulate matter wherein any stabilizer is less toxic than the metal of said metal salt of said electroless metallizing bath.
An electroless metallizing bath comprising an aqueous solution of a metal salt, a reducing agent, a complexing agent, and particulate matter wherein said electroless metallizing bath is essentially free of toxic metal stabilizers.
An electroless metallizing bath comprising an aqueous solution of a metal salt, a reducing agent, a complexing agent, and particulate matter wherein any stabilizer is less toxic than the metal of said metal salt of said electroless metallizing bath.
Dependencies are inferred from the claim text.