Spring contact structure and electronic device using same
AssigneeChi Mei Communication Systems, Inc.
InventorChin-Hung Wu
Life of this patent
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AssigneeChi Mei Communication Systems, Inc.
InventorChin-Hung Wu
Estimating the term…
A spring contact structure (10) and an electronic device using same are provided. The spring contact structure is configured for releasing electrostatic charges of the electronic device, and includes a fixing portion (12), a clamping portion (14) and a grounding portion (16). The clamping portion is configured for electrically connecting to a substrate (30) of the electronic device, and includes a first clamp arm (142) and a second clamp arm (144) extending from opposite sides of the fixing portion. The second clamp arm is disposed over the fixing portion and the first clamp arm to clamp the substrate between the first and second clamp arms. The grounding portion extends from the fixing portion, and is configured for electrically connecting to a grounding unit (40) of the electronic device.
A spring contact structure configured for releasing electrostatic charges of an electronic device comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.