Process of fabricating a circuit board
AssigneePPG Industries Ohio, Inc.
InventorsAlan E. Wang, Kevin C. Olson, Michael J. Pawlik
Life of this patent
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Abstract
A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
Claims37
A process for fabricating a circuit board comprising:
- providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side;
- forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening;
- using an acid etch comprising an HCl/CuClx/H2O2 mix, where x is 1 or 2 at a pH of about 1.5 to remove a portion of the conductive core to create a recessed edge of the conductive core in a cavity in a wall of the opening;
- and
- electrodepositing a third insulating material on the exposed edge of the first electrically conductive core.
Dependencies are inferred from the claim text.