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US 7,742,309 B2Granted
Electronic device and method of assembling an electronic device
AssigneeNokia Corporation
InventorsJussi Hakunti, Pekka Kilpi, Anssi Vänskä, Teppo Aapro, Harri Lasarov
Life of this patent
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Abstract
An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
Claims20
A device comprising:
- an electronic component;
- an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component;
- and
- injection molded material overlaying at least the portion of the electronic component and the overlaying protective layer wherein the electrically insulating protective layer is arranged to protect the electronic component during injection molding of the overlaying injection molded material.
1 more element
A method comprising:
- forming an electrically insulating protective layer over at least a portion of an electronic component, wherein the electronic component is mounted on a first side of a printed circuit board, and wherein the electrically insulating protective layer overlays and is in contact with at least the portion of the electronic component and at least a portion of the first side of the printed circuit board;
- and
- forming a molded layer over at least the portion of the electronic component and the overlaying protective layer by injection molding, wherein the molded layer is in contact with another different side of the printed circuit board.
A method comprising:
- mounting an electromagnetic shield to a printed circuit board;
- forming an electrically insulating protective layer between the electromagnetic shield and the printed circuit board, wherein the electrically insulating protective layer is in contact with the printed circuit board and the electromagnetic shield;
- attaching the printed circuit board to a substrate;
- injection molding over the printed circuit board;
- wherein the substrate forms part of an electronic device.
2 more elements
Dependencies are inferred from the claim text.