Manufacturing method of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsShinichi Ito, Kentaro Matsunaga, Daisuke Kawamura
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AssigneeKabushiki Kaisha Toshiba
InventorsShinichi Ito, Kentaro Matsunaga, Daisuke Kawamura
Estimating the term…
A manufacturing method of a semiconductor device including a liquid immersion movement exposure of interposing a liquid between an exposure target substrate and a projection optical system of an exposure apparatus, and carrying out an exposure processing with respect to a plurality of exposure regions set on a surface of the substrate while relatively moving the substrate with respect to the system, a first liquid immersion movement of relatively moving the substrate with respect to the system while interposing the liquid between the substrate and the system, in adjacent exposure regions of said each exposure region, and a second liquid immersion movement of relatively moving the substrate with respect to the system at a speed lower than a movement speed in the first movement, while interposing the liquid between the substrate and the system, in a distance that is longer than a movement distance in the first movement.
A manufacturing method of a semiconductor device comprising:
A manufacturing method of a semiconductor device comprising:
A manufacturing method of a semiconductor device comprising:
Dependencies are inferred from the claim text.