White LED package structure having a silicon substrate and method of making the same
AssigneeTouch Micro-System Technology Inc.
InventorsHung-Yi Lin, Hong-Da Chang
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Abstract
A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.
Claims7
A white LED package structure having a silicon substrate comprising:
- a silicon substrate having a plurality of cup-structures thereon, and a distance between the adjacent cup-structures is substantially less than 10 micrometers;
- a reflective layer covering a top surface of the silicon substrate;
- a transparent insulating layer covering the reflective layer;
- a plurality of metal bumps respectively disposed on the transparent insulating layer in each cup-structure;
- a plurality of electrodes disposed on the transparent insulating layer between the cup-structures;
- a plurality of blue LEDs having a plurality of various wavelengths, respectively disposed on each metal bump in each cup-structure, and the blue LEDs electrically connected to the electrodes;
- and
- a phosphor structure covering the cup-structures of the silicon substrate, the phosphor structure comprising a plurality of kinds of phosphor powders and a sealing material, and each kind of the phosphor powder capable of converting blue light within certain wavelength into yellow light.
Dependencies are inferred from the claim text.