Power semiconductor module with a connected substrate carrier and production method therefor

Abstract

A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cutout is smaller at the inner surface than at the outer surface. The housing has an extension that reaches into the cutout and may be deformed to form a riveted connection. The method comprises: forming a housing with at least one extension which extends towards the exterior of the module, wherein the extension projects through the cutout and beyond the outer surface of the carrier; and deforming the end of the extension so that it widens and forms a riveted connection and at the same time lies below the outer surface of the carrier.

Dependencies are inferred from the claim text.