Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same

An embedded type multifunctional integrated structure for integrating protection components, comprising:

• a top cover insulating layer having a first power input portion and two first signal input portions;
• an over-current protection layer disposed under the top cover insulating layer, wherein the over-current protection layer has a second power input portion and a first power output portion;
• a middle insulating layer disposed under the over-current protection layer;
• a multifunctional protection layer disposed under the middle insulating layer, wherein the multifunctional protection layer has a third power input portion, a first grounding portion, a first functional unit electrically connected between the third power input portion and the first grounding portion, two second signal input portions, and a second functional unit electrically connected between each second signal input portion and the first grounding portion;
• a bottom cover insulating layer disposed under the multifunctional protection layer, wherein the bottom cover insulating layer has a second power output portion, a second grounding portion, and two first signal output portions;
• and
• a lateral conductive unit having a first lateral conductive layer, a second lateral conductive layer, a third lateral conductive layer, a fourth lateral conductive layer, and a fifth lateral conductive layer insulated from each other, wherein each lateral conductive layer from top to bottom is formed on lateral sides of the top cover insulating layer, the over-current protection layer, the middle insulating layer, the multifunctional protection layer, and the bottom cover insulating layer in sequence;
• wherein the first power input portion and the second power input portion are electrically connected with each other via the first lateral conductive layer;
• the first power output portion, the third power input portion and the second power output portion are electrically connected with each other via the second lateral conductive layer;
• one of the first signal input portions, one of the two second signal input portions, and one of the first signal output portions are connected with each other via the third lateral conductive layer;
• the other first signal input portion, the other second signal input portion, and the other first signal output portion are connected with each other via the fourth lateral conductive layer;
• the first grounding portion and the second grounding portion are connected with each other via the fifth lateral conductive layer.