Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame

A one-dimensional or two-dimensional capacitive micro-machined ultrasonic transducer (CMUT) array with supporting frame comprising:

• a silicon-on-insulator (SOI) wafer comprising a device layer, a buried oxide layer and a handle layer, wherein said device layer comprises a first structure disposed therein and said handle layer comprises a second structure disposed therein, wherein said first structure comprises at least three CMUT array elements having a conductive top layer disposed on a top side of said CMUT array elements and said second structure comprises at least two isolation trenches comprising an open span in said handle layer and at least one conductive electrode disposed on a bottom surface of said handle layer, and a region of said handle layer between said trenches forms a mechanical support frame, wherein at least one conductive via is disposed within said array elements and spans from a top surface of said device layer through said buried oxide layer to electrically connect said first structure to said second structure and is isolated from said conductive top layer, wherein said conductive electrode is disposed to conduct with said via.