Electronic component and method for manufacturing the same

An electronic component comprising:

• an external electrode;
• a resin section that is made of resin and contacts with the external electrode;
• and
• an internal electrode covered with the resin section, wherein,
• irregularities made of the resin and with a height ranging from 1 μm to 10 μm inclusive are formed on one surface or two-or-more surfaces of at least the resin section.

A method for manufacturing an electronic component comprising:

• forming a predetermined pattern made of photoresist on a substrate;
• and
• forming an internal electrode on the substrate or on the photoresist-made pattern so as to have a predetermined pattern, wherein
• a plurality of bumps with a height ranging from 1 μm to 10 μm inclusive are formed on one surface or two-or-more surfaces of resin section made of the photoresist while said forming steps are repeated a plurality number of times.