Process for structuring at least one year as well as electrical component with structures from the layer

An electrical component formed as a surface wave component, comprising:

• a substrate, and
• a first layer and a second layer on the substrate, wherein the first layer is different from the second layer, the second layer is structured into a first structure, the first layer is structured into a second structure and the first layer is between the second layer and the substrate;
• wherein the first structure in the second layer is structured by an isotropic structuring process, the second structure is structured by an anisotropic structuring process and the first structure is different from the second structure, and
• wherein the first layer and the second layer form electrical conductors of the electrical component, the first structure includes a bond pad and the second structure includes contact lines, the contact lines are electrically conducting microstructures and the substrate includes a piezoelectric crystal.