Dielectric structure in nonvolatile memory device and method for fabricating the same
AssigneeHynix Semiconductor Inc.
InventorsKwon Hong, Kwan-Yong Lim
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Abstract
A dielectric structure in a nonvolatile memory device and a method for fabricating the same are provided. The dielectric structure includes: a first oxide layer; a first high-k dielectric film formed on the first oxide layer, wherein the first high-k dielectric film includes one selected from materials with a dielectric constant of approximately 9 or higher and a compound of at least two of the materials; and a second oxide layer formed on the first high-k dielectric film.
Claims17
A method for fabricating a dielectric structure of a nonvolatile memory device, wherein the nonvolatile memory device includes a floating gate, the dielectric structure and a control gate, the method comprising:
- forming a first oxide layer on the floating gate;
- forming a first high-k dielectric film on the first oxide layer, wherein the first high-k dielectric film includes one selected from materials with a dielectric constant of approximately 9 or higher and a compound of at least two of the materials;
- forming a second oxide layer on the first high-k dielectric film;
- forming a second high-k dielectric film on the second oxide layer by employing a material identical to the first high-k dielectric film;
- and
- forming a third oxide layer on the second high-k dielectric film;
- wherein forming the first and the second high-k dielectric films comprises controlling a dielectric constant of at least one of the first and second high-k dielectric films by adjusting a feeding ratio of metal atoms composing the individual compounds of the at least one of the first and second high-k dielectric films such that the dielectric constant decreases as the feeding ratio increases and the dielectric constant is controlled to have a range of approximately 9 to 20 according to the feeding ratio.
Dependencies are inferred from the claim text.