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US 7,741,157 B2Granted
System and method for direct bonding of substrates
AssigneeHewlett-Packard Development Company, L.P.
InventorsCharles C Haluzak, Arthur Piehl, Chien-Hua Chen, Jennifer Shih
Life of this patent
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Abstract
A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
Claims20
A method of forming a MEMS (Micro-Electro-Mechanical System), comprising:
- encasing a plurality of MEMS actuators in a sacrificial material;
- forming an ambient port through a MEMS cap which defines a cavity, the cavity containing the plurality of MEMS actuators therein;
- removing the sacrificial material using a fluid introduced into the cavity through the ambient port;
- and
- bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
2 more elements
A method of forming a MEMS (Micro-Electro-Mechanical System), comprising:
- forming an ambient port through a MEMS cap which defines a cavity, the cavity containing a plurality of MEMS actuators therein;
- introducing an anti-stiction material into the cavity prior to bonding of a lid arrangement to the MEMS cap;
- bonding the lid arrangement to the MEMS cap to hermetically seal the ambient port;
- and
- removing the anti-stiction material from an outboard surface of the MEMS cap during a plasma bonding process executed in connection with the bonding of the lid arrangement to the MEMS cap.
2 more elements
Dependencies are inferred from the claim text.