Method and system for determining condition of process performed for coating film before immersion light exposure

#1. Field of the Invention

#The present invention relates to a process condition determining method for determining a condition of a predetermined process for preparing a process target, which comprises a coating film, so as to prevent film peeling from occurring in the coating film when performing immersion light exposure after the predetermined process. The present invention also relates to a process condition determining system and a computer readable storage medium that stores a control program both for executing the process condition determining method.

#In the process of manufacturing semiconductor devices, photolithography techniques are used for forming circuit patterns on semiconductor wafers. Where a circuit pattern is formed by use of photolithography, the process steps are performed, as follows. Specifically, a resist liquid is first applied to a semiconductor wafer to form a resist film. Then, the resist film is irradiated with light to perform light exposure on the resist film in accordance with the circuit pattern. Then, the resist film is subjected to a developing process.

#The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.

#FIG. 1 is a plan view schematically showing the structure of a pattern forming apparatus, which can utilize a process condition determining method for a coating film to be subjected to immersion light exposure, according to an embodiment of the present invention;

#FIG. 2 is a perspective view schematically showing the pattern forming apparatus;

#An embodiment of the present invention will now be described with reference to the accompanying drawings. In the following description, the constituent elements having substantially the same function and arrangement are denoted by the same reference numerals, and a repetitive description will be made only when necessary.

#FIG. 1 is a plan view schematically showing a pattern forming apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing the pattern forming apparatus. The pattern forming apparatus 1 is designed to form a predetermined resist pattern on a semiconductor substrate or wafer W. This pattern forming apparatus 1 includes a cassette station 11 used as a transfer station for wafers W, a process station 12 comprising a plurality of processing units each for performing a predetermined process on a wafer W, a light exposure apparatus 14 for performing a light exposure process on a wafer W, and an interface station 13 for transferring wafers W between the process station 12 and light exposure apparatus 14. The cassette station 11, process station 12, interface station 13, and light exposure apparatus 14 are arrayed in series in this order in the longitudinal direction of the pattern forming apparatus 1 (Y-direction).

#The cassette station 11 includes a cassette table 11a for placing thereon wafer cassettes (CR) each storing a plurality of, such as 13, wafers W, and a wafer transfer mechanism 11c for transferring wafers W between the wafer cassettes (CR) placed on the cassette table 11a and a transition unit located in a third processing unit group G3 in the process station 12 described later. The cassette table 11a and wafer transfer mechanism 11c are arrayed in series in this order in the Y-direction. The cassette table 11a has a plurality of, e.g., five positioning portions lib each for positioning a wafer cassette (CR), arrayed thereon in the width direction of the pattern forming apparatus 1 (X-direction). A wafer cassette (CR) is placed at each of the positioning portions 20a such that its transfer port faces an opening/closing portion lie formed in a wall of the casing of the wafer transfer mechanism 11c. The wafer transfer mechanism 11c includes a transfer pick 11d disposed in the casing for handling wafers W, so that the wafers W are transferred by the transfer pick 11d between the wafer cassettes (CR) on the cassette table 11a and the transition unit.