Method and system for electrically coupling a chip to chip package
AssigneeMicron Technology, Inc.
InventorsTim Murphy, Lee Gotcher
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsTim Murphy, Lee Gotcher
Estimating the term…
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.
A microelectronic package, comprising:
A microelectronic package, comprising:
A chip, comprising an electronic circuit coupled to a converter, the converter operable to receive electrical signals from the electronic circuit, the converter further operable to convert the received electrical signals into corresponding electromagnetic signals and transmit the electromagnetic signals through the chip, the converter further operable to receive electromagnetic signals transmitted through the chip and convert the received electromagnetic signals into corresponding electrical signals to be applied to the electronic circuit.
A memory device, comprising:
Dependencies are inferred from the claim text.