Process for producing and apparatus for improving the bonding between a plastic and a metal
AssigneeInfineon Technologies AG
InventorsBernd Betz, Jochen Dangelmaier, Stefan Paulus
Life of this patent
Estimating the term…
Abstract
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
Claims26
A process for producing a leadframe configured to be fitted with a semiconductor chip and to be encapsulated with a plastic compound, the process comprising:
- providing a leadframe base body;
- applying an interlayer attackable by an etchant that comprises one or more individual layers, to the leadframe;
- and
- etching into the surface of the interlayer using the etchant to form a matrix of islands of remaining material of substantially uniform height with voids extending between these islands.
A process for producing a semiconductor device, comprising:
- producing a leadframe base body including, providing the leadframe, applying an interlayer attackable by an etchant that comprises one or more individual layers, to the leadframe base body, and etching into the surface of the interlayer using the etchant to form a matrix of islands of remaining material of substantially uniform height with voids extending between these islands;
- placing a semiconductor chip onto the leadframe base body;
- and
- applying a plastic compound as encapsulating housing to the leadframe base body and semiconductor chip.
A semiconductor device including a semiconductor chip and to be encapsulated with a plastic compound, the semiconductor device comprising:
- a metallic single-piece base body of a leadframe,
- at least one interlayer which has been applied to the base body and may comprise one or more individual layers, and
- the interlayer having a surface comprising a matrix of islands of remaining material of substantially uniform height with voids extending between these islands.
A semiconductor device comprising:
- a semiconductor chip and having an encapsulation of plastic compound;
- a metallic single-piece base body of a leadframe, and at least one interlayer which has been applied to the base body and may comprise one or more individual layers, and
- the interlayer having a surface comprising a matrix of islands of remaining material of substantially uniform height with voids extending between these islands.
Dependencies are inferred from the claim text.