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US 7,732,303 B2Granted
Method for recycling of ion implantation monitor wafers
AssigneeInternational Business Machines Corporation
InventorsSteven Ross Codding, Joseph R. Greco, Timothy Charles Krywanczyk
Life of this patent
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Abstract
A method of recycling monitor wafers. The method includes: (a) providing a semiconductor wafer which includes a dopant layer extending from a top surface of the wafer into the wafer a distance less than a thickness of the wafer, the dopant layer containing dopant species; after (a), (b) attaching an adhesive tape to a bottom surface of the wafer; after (b), (c) removing the dopant layer; and after (c), (d) removing the adhesive tape.
Claims25
A method, comprising:
- (a) ion implanting a dopant species into a semiconductor wafer to form a dopant layer in said semiconductor wafer, said dopant layer extending from a top surface of said wafer into said wafer a distance less than a thickness of said wafer;
- after (a), (b) attaching an adhesive tape to a bottom surface of said wafer, said adhesive tape comprising an adhesive layer on a base layer, said adhesive bonding said base layer to said bottom surface of said wafer, said adhesive layer bonded more strongly to said base layer than to said bottom surface of said wafer;
- after (b), (c) removing said dopant layer;
- and
- after (c), (d) removing said adhesive tape.
2 more elements
A method, comprising:
- (a) providing a semiconductor wafer;
- (b) ion implanting a dopant species into said wafer to form a dopant layer in said wafer, said dopant layer extending from a top surface of said wafer into said wafer a distance less than a thickness of said wafer;
- after (b), (c) attaching an adhesive tape to a bottom surface of said wafer, said adhesive tape comprising an adhesive layer on a base layer, said adhesive bonding said base layer to said bottom surface of said wafer, said adhesive layer bonded more strongly to said base layer than to said bottom surface of said wafer;
- after (c), (d) removing said dopant layer;
- and
- after (d), (e) removing said adhesive tape;
- and
- after (e), (f) repeating steps (b) through (e) on said wafer a predetermined number of times.
5 more elements
Dependencies are inferred from the claim text.