Photomask with overlay mark and method of fabricating semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsDo-Yul Yoo, Ji-Yong You, Joong-Sung Kim, Hyung-Joo Youn
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Abstract
Provided are a photomask and a method of fabricating a semiconductor device. The photomask includes a photomask substrate including a chip region and a scribe lane region, with an overlay mark formed in the scribe lane region. The overlay mark includes one or more sub-overlay marks. Each of the sub-overlay marks includes a plurality of unit regions sequentially connected to each other and having different widths, where the width of a given unit region is constant.
Claims28
A photomask comprising:
- a photomask substrate including a chip region and a scribe lane region;
- and
- an overlay mark formed in the scribe lane region,
- wherein the overlay mark includes one or more sub-overlay marks, and each of the sub-overlay marks includes a plurality of unit regions sequentially connected to each other and having different widths.
A method of fabricating a semiconductor device, comprising:
- preparing a semiconductor substrate;
- and
- forming a main overlay mark having one or more sub-overlay marks on the semiconductor substrate, with each of the sub-overlay marks including a plurality of unit regions sequentially connected to each other and having different widths.
A method of fabricating a semiconductor device, comprising:
- forming overlay marks on two adjacent layers of a semiconductor device, each of the sub-overlay marks including a plurality of unit regions sequentially connected to each other and having different widths;
- measuring an overlay accuracy value between the adjacent layers using a selected one of the unit regions;
- and
- removing one of the layers if the overlay accuracy value is greater than an allowable accuracy value.
Dependencies are inferred from the claim text.