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US 7,732,009 B2Granted
Method of cleaning reaction chamber, method of forming protection film and protection wafer
AssigneeUnited Microelectronics Corp.
InventorsChih-Jen Mao, Chun-Hung Hsia, Ta-Ching Yang, Chun-Cheng Yu, Chien-Fu Chu, Kuo-Wei Yang, Chun-Han Chuang, Hui-Shen Shih
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Abstract
A method of cleaning a reaction chamber having a wafer holder is provided. First, the reaction chamber is cleaned by a cleaning gas. Next, a protection film is formed on the inner surface of the reaction chamber, wherein a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided therebetween simultaneously.
Claims15
A method of cleaning a reaction chamber, the reaction chamber having a wafer holder, the method comprising the following steps:
- cleaning the reaction chamber using a cleaning gas;
- and
- forming a protection film on an inner surface of the reaction chamber, wherein when forming the protection film, a plurality of supporting pins is disposed on the wafer holder and a protection wafer is provided on the supporting pins, so that the supporting pins create a gap between the protection wafer and the wafer holder for preventing the protection wafer from contacting the wafer holder at any point, and a cooling gas is guided between the protection wafer and the wafer holder simultaneously,
- wherein when cleaning the reaction chamber, the supporting pins are not provided on the wafer holder.
1 more element
Dependencies are inferred from the claim text.