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AssigneeToyo Tire & Rubber Co., Ltd.
InventorsTetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Kazuyuki Ogawa, Atsushi Kazuno, Masahiro Watanabe
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The object of the invention is to provide a polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of use to the end of use even if polishing is performed with an alkaline or acid slurry, as well as a method of manufacturing a semiconductor device with this polishing pad. The polishing pad of the invention is used in chemical mechanical polishing and has a polishing region and a light-transmitting region, wherein the light-transmitting region satisfies that the difference ΔT (ΔT=T0−T1) (%) between T0 and T1 is within 10(%) over the whole range of measurement wavelengths of from 400 to 700 nm, wherein T1 is the light transmittance (%) of the light-transmitting region measured at the measurement wavelength λ after dipping for 24 hours in a KOH aqueous solution at pH 11 or an H2O2 aqueous solution at pH 4 and T0 is the light-transmittance (%) measured at the measurement wavelength λ before the dipping.
A method of manufacturing a polishing pad used for chemical mechanical polishing comprising a polishing region, and a light-transmitting region, said method comprising:
A method of manufacturing a polishing pad used for chemical mechanical polishing comprising a polishing region, and a light-transmitting region, said method comprising:
Dependencies are inferred from the claim text.