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US 7,686,991 B2Granted
Method of aligning a die and stamping a substrate for nano-imprint lithography
AssigneeWD Media, LLC
InventorBruce M. Harper
Life of this patent
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Abstract
A method of aligning die and stamping substrate for nano-imprint lithography is described. The method includes aligning the die by linearly displacing the die along a first axis using a first flexure member and pressing the die along a second axis substantially perpendicular to the first axis while maintaining coupling of the die with the first flexure member.
Claims22
A method of stamping a substrate, comprising:
- providing a die and a first flexure member;
- aligning the die by linearly displacing the die along a first axis using the first flexure member;
- and
- pressing the die along a second axis substantially perpendicular to the first axis while maintaining coupling of the die with the first flexure member.
1 more element
Dependencies are inferred from the claim text.