Substrate treatment method and substrate treatment apparatus

Abstract

A substrate treatment method is disclosed, which can effectively reduce the amount of charges accumulated on a substrate due to treatment of the substrate with a water-containing liquid. The method comprises the steps of: supplying a water-containing liquid to a substrate held generally horizontally by a substrate holding/rotating mechanism while rotating the substrate at a first rotation speed; and removing charges from the substrate after the water supplying step by performing a puddle process for a predetermined period by retaining a liquid film of a predetermined liquid on a surface of the substrate held generally horizontally by the substrate holding/rotating mechanism with the substrate being rotated at a second rotation speed lower than the first rotation speed or kept in a non-rotating state without further supplying the predetermined liquid to the liquid film.

Dependencies are inferred from the claim text.