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US 7,682,431 B1Granted
Plating solutions for electroless deposition of ruthenium
AssigneeLam Research Corporation
InventorsAlbina Zieliene, Algirdas Vaskelis, Eugenijus Norkus
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Abstract
An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solution is also provided.
Claims18
An electroless ruthenium plating solution, comprising:
- a ruthenium source;
- a polyamino polycarboxylic acid complexing agent;
- a reducing agent;
- hydroxylamine hydrosulphate ((NH2OH)2H2SO4), which functions as a stabilizing agent;
- and
- a pH-modifying substance.
3 more elements
An electroless ruthenium plating solution, comprising:
- a ruthenium source;
- a polyamino polycarboxylic acid complexing agent consisting essentially of one of nitrilotriacetic acid (NTA) or trans-cyclohexane-1,2-diamine tetraacetic acid (CDTA);
- NaBH4 as a reducing agent;
- a stabilizing agent;
- and
- a pH-modifying substance.
3 more elements
An electroless ruthenium plating solution, comprising:
- (RuNO)2(SO4)3 as a ruthenium source;
- a polyamino polycarboxylic acid complexing agent;
- a reducing agent;
- a stabilizing agent;
- and
- a pH-modifying substance.
3 more elements
Dependencies are inferred from the claim text.