Protection of an integrated circuit and method thereof

A method of improving a reliability of an integrated circuit comprising a power device, the method comprising the steps of:

• measuring a first temperature of the power device;
• measuring a second ambient temperature associated with the power device, wherein the step of a measuring a second ambient temperature associated with the power device comprises measuring an ambient temperature of an associated non-high power die,
• calculating a temperature gradient between the power device and the non-high power die in response to the steps of measuring;
• determining whether the calculated temperature gradient has exceeded a threshold;
• and
• implementing a power reduction process applied to the power device if the temperature gradient exceeds a threshold.

A method of improving a reliability of an integrated circuit comprising a power device, the method comprising the steps of:

• measuring a first temperature of the power device;
• measuring a second ambient temperature associated with the power device;
• calculating a temperature gradient across a portion of the power device in response to the steps of measuring;
• determining whether the calculated temperature gradient has exceeded a threshold;
• implementing a power reduction process applied to the power device if the temperature gradient exceeds a threshold,
• incrementing a counter if the determined temperature gradient exceeds a threshold;
• determining whether the Counter has exceeded a threshold;
• and
• implementing a power reduction process applied to the power device if the Counter exceeded threshold.

An integrated circuit comprising:

• a power device located on a die;
• and
• a processing function operably coupled to the power device, wherein the processing function is operably coupled to two or more temperature sensors wherein a first temperature sensor is operably coupled to the power device to measure a temperature of the power device and the second temperature sensor is located such that it measures a substantially ambient temperature related to the die and the processing function determines the temperature gradient therebetween;
• wherein the processing function is a digital circuit and in response to the digital circuit determining the temperature gradient between the power device and an ambient temperature, the digital circuit implements a protection process to protect the power device;
• wherein the second temperature sensor is operably coupled to a non-high power device or die.