Wafer movement control macros

A computer-implemented method for creating a set of wafer transfer instructions configured to transfer a wafer between an origination wafer-holding location and a destination wafer-holding location in a plasma cluster tool, said plasma cluster tool having a plurality of wafer-holding locations, said method comprising:

• receiving a first user-provided location indicator, said first user-provided location indicator graphically identifying said origination wafer-holding location on an on-screen graphical representation of said plasma cluster tool;
• receiving a second user-provided location indicator, said second user-provided location indicator graphically identifying said destination wafer-holding location on said on-screen graphical representation of said plasma cluster tool;
• ascertaining data pertaining to a path between said first user-provided location indicator and said second user-provided location indicator, said path traversing at least one other wafer-holding location other than said origination wafer-holding location and said destination wafer-holding location, said path including identities of wafer-holding locations between said origination wafer-holding location and said destination wafer-holding locations;
• using a sensor associated with a first wafer-holding location to report said first-wafer holding location as unsuitable for accepting said wafer;
• flagging at least said first wafer-holding location of said plasma cluster tool as being excludable;
• excluding said first wafer-holding location from a list of nodes used for forming said path;
• and
• forming said set of wafer transfer instructions responsive to said data pertaining to said path, said set of wafer transfer instructions being configured to transfer said wafer along said wafer-holding locations associated with said path.

A computer-implemented method for creating a set of wafer transfer instructions configured to transfer a wafer between an origination wafer-holding location and a destination wafer-holding location in a plasma cluster tool, said plasma cluster tool having a plurality of wafer-holding locations, said method comprising:

• ascertaining said origination wafer-holding location;
• ascertaining said destination wafer-holding location;
• automatically ascertaining data pertaining to a path between said origination wafer-holding location and said destination wafer-holding location, said path traversing at least one other wafer-holding location other than said origination wafer-holding location and said destination wafer-holding location, said path including identities of wafer-holding locations between said origination wafer-holding location and said destination wafer-holding locations;
• using a sensor associated with a first wafer-holding location to report said first-wafer holding location as unsuitable for accepting said wafer;
• flagging at least said first wafer-holding location of said plasma cluster tool as being excludable;
• excluding said first wafer-holding location from list of nodes used for forming said path;
• and
• automatically forming said set of wafer transfer instructions responsive to said data pertaining to said path, said set of wafer transfer instructions being configured to transfer said wafer along said wafer-holding locations associated with said path.