Cooling air distribution scheme for communication boards
AssigneeSolarflare Communications, Inc.
InventorsMichael Joseph Musciano, Douglas Ronald Daniels, Nasser Barabi
Life of this patent
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Abstract
A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces.
Claims14
A cooling configuration for chassis-mounted electronics boards, comprising:
- a housing, said housing having a top, a bottom, a front and a rear and defining a generally enclosed interior space;
- a first electronics board, the first electronics board comprising:
- one or more ports, a first side and a second side, a front edge and a plurality of notches extending rearwardly into said first electronics board from said front edge;
- a second electronics board, the second electronics board comprising:
- one or more ports, a first side and a second side, a front edge and a plurality of notches extending rearwardly into said second electronics board from said front edge;
- at least two cooling air spaces adjacent a combination of said first and second electronics boards;
- at least one cooling air intake in said housing, said front edge of said first electronics board and said front edge of said second electronics board located adjacent at least one of said cooling air intakes;
- and
- at least one air exhaust in said housing in communication with said at least two cooling air spaces;
- whereby cooling air which flows into said housing through said at least one cooling air intake is distributed at least in part by said notches in said first and second electronics boards to said at least two cooling air spaces, flows through said cooling air spaces and exhausts out of said housing through said at least one air exhaust;
- wherein said at least one cooling air intake is located at said front of said housing and said at least one air exhaust is located at said rear of said housing and wherein said front edges of said first and second electronics boards are located at said front of said housing.
A cooling configuration for a chassis-mounted electronics board, comprising:
- a housing, said housing having a top, a bottom, a front and a rear and defining a generally enclosed interior space;
- at least one electronics board having one or more ports, a first side and a second side, a front edge and a plurality of notches extending rearwardly into said board from said front edge;
- a first cooling air space at said first side of said electronics board and a second cooling air space at said second side of said electronics board;
- at least one cooling air intake in said housing, said front edge of said at least one electronics board located adjacent at least one of said cooling air intakes;
- and
- at least one air exhaust in said housing in communication with said first and second cooling air spaces;
- whereby cooling air which flows into said housing through said at least one cooling air intake is distributed at least in part by said notches in said at least one electronics board to said at first and second cooling air spaces, flows through said cooling air spaces and exhausts out of said housing through said at least one air exhaust;
- wherein one or more cooling air intakes are located at said front of said housing and said front edge of said at least one electronics board is located at said front of said housing.
Dependencies are inferred from the claim text.