Heat sink and electronic apparatus using the same
AssigneeWistron Corporation
InventorChia-Ming Lee
Life of this patent
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Abstract
A heat sink and an electronic apparatus using the same are disclosed. The heat sink comprises a fin structure and a fastening assembly; the fastening assembly comprises an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member combines the hooking member, the elastic member, and the fin structure; wherein the hooking member may secure the heat sink onto an electronic component, and the adjustable positioning member may be used to adjust the tightness between the heat sink and the electronic component.
Claims16
A heat sink applicable to an electronic apparatus comprising a circuit board having an electronic component, the heat sink comprising:
- a fin structure;
- and
- a fastening assembly comprising an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member couples the hooking member, the elastic member, and the fin structure;
- wherein the hooking member secures the heat sink on the electronic component, and the adjustable positioning member adjusts a tightness of the securement between the heat sink and the electronic component.
An electronic apparatus comprising:
- a housing;
- a circuit board disposed in the housing, the circuit board comprising at least one electronic component;
- and
- at least one heat sink mounted on the at least one electronic component, each heat sink comprising:
- a fin structure;
- and
- a fastening assembly comprising an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member couples the hooking member, the elastic member, and the fin structure;
- wherein the hooking member secures the heat sink on the electronic component and the adjustable positioning member adjusts a tightness of the securement between the heat sink and the electronic component.
Dependencies are inferred from the claim text.