Method for compensating film height modulations in spin coating of a resist film layer
AssigneeQimonda AG
InventorThomas Mülders
Life of this patent
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Abstract
A method compensates film height modulations in spin coating of a resist film layer. From a desired layout pattern, a substrate topography as a result of lithographically structuring in image fields is determined. A spin coating model is provided to determine a modeled resist film height based on the substrate topography during spin coating of a resist film. A nominal resist film height by using the spin coating model with an unperturbed substrate topography having a flat surface is determined. Next, film height modulations based on a difference are determined for test points and the desired layout pattern is optimized by implementing further structural elements in order to form an optimized mask pattern by minimizing the film height modulations.
Claims40
A method for compensating film height modulations in spin coating of a resist film layer, the method comprising:
- providing a desired layout pattern comprising a plurality of structural features, each structural feature having a characteristic feature size;
- determining a substrate topography as a result of lithographically structuring a substrate with said desired layout pattern in a plurality of image fields;
- providing a spin coating model, said spin coating model being applicable to determine a modeled resist film height based on said substrate topography during spin coating of a resist film;
- determining a nominal resist film height by using said spin coating model with an unperturbed substrate topography having a flat surface;
- selecting a plurality of test points on said substrate;
- determining film height modulations based on a difference of said nominal resist film height and said modeled resist film height for each of said test points;
- and
- optimizing said desired layout pattern by implementing further structural elements in order to form an optimized mask pattern by minimizing said film height modulations.
A method for compensating film height modulations in spin coating of a resist film layer, the method comprising:
- providing a desired layout pattern comprising a plurality of structural features each having characteristic feature sizes;
- determining a substrate topography as a result of lithographically structuring a substrate with said desired layout pattern in plurality of image fields;
- providing a spin coating model, said spin coating model being applicable to determine a modeled resist film height based on said substrate topography during a spin coating step of a resist film on said substrate as a function of respective positions on said substrate;
- determining a modeled resist film height for each of said respective positions on said substrate;
- determining a nominal resist film height by using said spin coating model with an unperturbed substrate topography having a flat surface;
- determining an average resist film height based on said nominal resist film height;
- determining film height modulations based on a difference of said average resist film height and said modeled resist film height for each of said respective positions;
- and
- optimizing said desired layout pattern by implementing further structural elements in order to form an optimized mask pattern by minimizing said film height modulations.
A method for compensating film height modulations in spin coating of a resist film layer, the method comprising the steps of:
- providing a desired layout pattern comprising a plurality of structural features each having characteristic feature sizes;
- determining a substrate topography as a result of lithographically structuring a substrate with said desired layout pattern in plurality of image fields, said image fields having an active area and a surrounding kerf area;
- providing a spin coating model, said spin coating model being applicable to determine a modeled resist film height based on said substrate topography during spin coating of a resist film;
- determining a nominal resist film height by using said spin coating model with an unperturbed substrate topography having a flat surface;
- selecting a plurality of test points on said substrate;
- determining film height modulations based on a difference of said nominal resist film height and said modeled resist film height for each of said test points;
- and
- optimizing said desired layout pattern by implementing further structural elements in order to form an optimized mask pattern by minimizing said film height modulations.
Dependencies are inferred from the claim text.